LabVIEW Interfacing & Testing of an Electroplating System

          




Project Time Frame: January 2005 - December 2005

Material: Jig Material: Polytetrafluoroethylene, PTFE (Teflon) 

Project Aim: * Implement LabVIEW interfacing of an electroplating power supply 
                  * Design & fabricate an elctroplating jig capable of facilitating various  
                substrate shapes & sizes 
             * Electroforming of micro meter size features             

Abstract: In this project, an electro- plating system for the fabrication of micro and nano structures was developed. The three important objectives of this project were LabVIEW interfacing of an electro- plating power supply, design and fabrication of an electroplating jig which can accommodate three different substrate sizes, and electroforming of test patterns with micro meter size features. The final product of this project is an automated potentiostat connected to an electroplating jig to facilitate plating of a large number of micro structures on a single substrate which was tested and verified with the fabrication of micro structures.

Background: Electroforming is an age old technology which has been extensively used for the deposition of thick metallic coatings for various applications. This has recently been modified to suit the high technology applications related to Micro Electronic Mechanical Systems (MEMS) and nano technology. In this context the current project aims to develop an electroplating setup suitable for the fabrication of micro and nano structures. The goals of this project are LabVIEW interfacing of an electroplating power supply, design and fabrication of a simple jig, and testing and electroforming of test patterns.


Related Publications:

LabVIEW Interfacing & Testing of an Electroplating System - Senior Design Conference, Western Michigan University, 2005. View

Related Presentations:

LabVIEW Interfacing & Testing of an Electroplating System - Senior Design Conference, Western Michigan University, 2005. View
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