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Hybrid Laser-Single Point Diamond Turning Machining Process for Smoothing Ceramics


Project Time Frame: September 2007 – December 2007 

Material:3C Beta Polycrystalline CVD Coated Silicon Carbide (SiC)        

Project Aim: * Develop a hybrid method between laser ablation & SPDT                                                  

                  * Improve surface roughness of material
             * Maximize on material removal rate
             * Minimize diamond tool wear
Project Description: Silicon carbide (SiC) is an advanced engineered ceramic material designed to operate in extreme environments. One of the main reasons for the choice of this material is due to its excellent electrical, mechanical and optical properties that benefit the semiconductor, MEMS and optoelectronic industry respectively. Manufacture of this material is extremely challenging due to its high hardness, brittle characteristics and poor machinability. Severe fracture can result when machining SiC due to its low fracture toughness. However, from past experience it has been proven that ductile regime machining of silicon carbide is possible. This paper reports the results of work conducted to improve the surface quality of a chemically vapor deposited (CVD) polycrystalline SiC (3-C) material using a hybrid laser-SPDT machining process. In addition to improving the surface roughness of the material, this work also emphasized increasing the material removal rate (MRR) and minimizing the diamond tool wear. The results in this paper demonstrate that the overall surface roughness (Ra and Rz) of the machined regions have significantly improved (Ra decreased by 50% and Rz decreased by almost 75%) after the hybrid laser-SPDT operation just after a single machining pass. 


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